Technical capabilities (hard board) |
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Product Range |
Multilayer (4-28), HDI (4-20) soft board, Rigid-Flex PCB |
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Double panel |
CEM-3, FR-4, Rogers RO4233, Bergquist heat resistance CCL 4mil-126mil (0.1mm-3.2mm) |
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Multilayer |
4-28 layer thickness of 8 mil-126 mil (0.2mm-3.2mm) |
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Blind and buried vias |
4-20 layer thickness of 10 mil-126 mil (0.25mm-3.2mm) |
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HDI |
1 + N + 1,2 + N + 2,3 + N + 3, LDP or RCC |
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Metal substrate |
Aluminum plate, copper substrate |
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FPC, Rigid-Flex PCB |
1-8 layer soft board, 2-12 layer Flex PCB HDI rigid-flex board |
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Sheet |
Shengyi 、Kingboard & etc. |
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Liquid photosensitive green |
Taiyo, Goo's, Probimer FPC ink |
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Peelable green oil |
Peters |
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Conductive carbon oil |
Nipon |
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Hot air leveling (HASL) |
Tin thickness 40 to 1,600 c in (1 - 40 um) |
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Antioxidant treatment (OSP) |
Entek Plus HT, Preflux F2 LX |
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Electroless gold-plated |
Au:2to4uin(0.05~0.10um) Ni:120~250uin(3.00~6.25um) |
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State Ni- gold plating |
Au:min12uin(0.3um) Ni:120~600uin(3~15um) |
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Gold-plated fingers thick Au |
Au5 ~ 50 uin (0.125 ~ 1.27um); Ni thickness: 100 ~ 250 uin (2.50 ~ 6.25um) |
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Shen tin thick |
ATO:min40uin(1.0um);Ormecon Nano:12~20uin(0.3~0.5um) |
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technical skills |
Production |
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Minimum mechanical drilling |
8mil(0.20mm) |
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Minimum aperture laser |
4mil (0.100mm) |
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Line Width / Space |
3mil/3mil |
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The largest producer of |
21.5" X 24.5"(546mm X 622mm) |
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Line Width / Space |
+/-10% ~ +/-20% |
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Shen copper aperture |
+/-0.002inch(0.050mm) |
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Non-PTH aperture |
+/-0.002inch(0.050mm) |
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Hole precision |
+/-0.002inch(0.050mm) |
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Hole to edge accuracy |
+/-0.004inch(0.100mm) |
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Edge to edge accuracy |
+/-0.004inch(0.100mm) |
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Layer to layer alignment |
+/-0.003inch(0.075mm) |
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Impedance control |
+/- 8% |
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Bending degree |
Max≤0.5% |
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Technical capabilities (HDI board) |
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ITEM |
output |
Strict control output |
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Laser drilling / Padded |
0.125/0.30 、 0.125/0.38 |
0.125/0.28 、 0.125/0.36 、 0.20/0.40 |
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Blind drill / Padded |
0.25/0.50 |
0.20/0.45 |
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Line Width / Space |
0.10/0.10 |
0.075/0.075 |
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Hole |
CO2 Laser Direct Drill |
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Sheet |
FR4 LD (LDD); RCC 50 ~ 100 microns |
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Hole wall copper |
Blind hole: 10um (minimum) |
Buried hole: 13um (minimum) |
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Aspect Ratio |
0.8 : 1 |
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Technical capability (FPC) |
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Material Name |
PI thickness (um) |
Adhesive thickness (um) |
Copper Cu thickness |
Rolled copper Cu thickness |
Single layers of |
12.5;25;50 |
NA |
12;18;35 |
18;35 |
Sided layers of |
12.5;25;50 |
NA |
12;18;35 |
18;35 |
Three-sided material |
12.5;25;50 |
12;20 |
18;35 |
18;35 |
Three-sided material |
12.5;25;50 |
12;20 |
18;35 |
18;35 |
Cover film |
12.5;25 |
15;25;30 |
NA |
NA |
Pure adhesive tabs |
NA |
12.5;25;35; |
NA |
NA |
PP sheet adhesive |
NA |
40;75 |
NA |
NA |
